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QCT Carrier-grade Edge Server with 4th Gen Intel Xeon Scalable processor and Intel® FlexRAN for vRAN Boost
featuring an embedded FEC accelerator for accelerating high-performance, energy-efficient vRAN development
QCT EGX74I-1U vRAN Developer Kit
With the growing volumes of data and future requirements for transforming networks at the edge, QCT has been developing a series of products to improve efficiency and optimize workload performance in its QuantaEdge servers with Intel’s latest Xeon Scalable processors. To accelerate the adoption of 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost, QCT and Intel are collaborating on a series of development kits that will enable software vendors and end users to take advantage of new features in these new processors to deliver the pre-validated server with vRAN performance boost for RAN Distributed Unit (DU) power efficiency.
Functional
System
Validation
Function, BIOS, Management, Stress, Performance
Hundreds &
Thousands
FlexRAN Test Cases
O-RAN Validation
EGX74I-1U
1U1N Carrier-Grade Edge Server Ultra Short Depth Rackmount Server
- Intel 4th Gen Intel® Xeon® Scalable Processors w/ Intel® vRAN Boost
- Ultra 400mm Short Depth, + cabling < 450mm
- 3x PCIe Expansions
- GR63 Level 3 -5~+55 ° C
- GR3108 Class 2 -40~+65 ° C
- Power Efficiency (smart fan control, power redundancy)
- Pre-load OS and FlexRAN binary code with test case for Cyclictest, FlexRAN TestMac
Powered by 4th gen Intel® Xeon® Scalable Processors
Dev Kit Program Plug-and Play from the very Beginning
“Intel is continuing to work to enhance its leadership in various arenas with our latest 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost.
With partners, like QCT, we are demonstrating how customers can leverage our technology with the
latest innovations to create reliable and secure environments for real world applications that
meet the requirements of a number of different
vertical markets.”
Vice President in the Network and Edge Group and General Manager of the Wireless Access Division at Intel.
Cristina Rodriguez
QCT Dev Kit optimized design for vRAN Boost
vRAN Capacity
In the same power envelope
Additional Compute Power Savings
Beyond 4th Gen Intel Xeon Scalable Processor alone
Specifications: 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost | |||||||
| Cores | Capacity | Scalability | Memory Channels | Platform Compatibility | Accelerator Software Interface | Software Portability | SKU Variants |
| Up to 20 | Up to 3x 100 MHz 64T64R | 1S | 8 channels, up to 4000 MT/s | Compatible with existing platforms supporting 4th Gen Intel Xeon Scalable processors | Standard DPDK BBDEV API | Software-compatible with solutions on 3rd Gen Intel Xeon Scalable processors | Extended Temperature and Intel® AMX-enabled variants available |
| Up to 32 | Up to 6x 100 MHz 64T64R | 1S | 8 channels, up to 4400 MT/s | ||||
4th Gen Product Features
Intel features
QCT systems powered by 4th Gen Intel® Xeon® Scalable Processors Platform
Support up to 60 CPU cores, PCIe Gen5, 8 channel DDR5 memory
Increase up to 15% performance over the previous generation CPU with higher core count
Improve performance of memory bandwidth with 4th Gen Intel Xeon Scalable Processors plus High Bandwidth Memory (HBM)
Enhanced data protection with Intel® Software Guard Extensions (SGX) and Intel® Platform Firmware Resilience (PFR)
QCT features
Advanced air cooling with up to 350W TDP CPU and liquid cooling
Optimized for AI acceleration: Supports up to 3x single-width accelerators in 1U systems and up to 6x single-width, 2x dual-width accelerators in 2U systems
OCP 3.0 and management module DC-SCM 1.0 support
E1.S support to enable high-performance drives
Enhanced serviceability with tool-less, hot-swap designs (HDD, SSD, fan, PSU, PCIe riser bracket)
QCT system management tool: Orqestra
Gen to Gen CPU comparison
Features | 3rd Gen Intel® Xeon® Scalable Processor | 4th Gen Intel® Xeon® Scalable Processor |
|---|---|---|
Cores Per Socket | Up to 40 Core | Up to 60 Core |
TDP (W) | 105W – 270W | 125W – 350W |
UPI Speed (GT/s) | Up to 3x UPI @ 11.2 GT/s | Up to 4x UPI @ 16 GT/s |
PCIe Lanes/ Speed (GT/s) | 64 / PCIe 4.0 (16 GT/s) | 80 / PCIe 5.0 (32 GT/s) |
Memory – Qty | 16 DIMM per socket (2DPC, 8 channel DDR4) | 16 DIMM per socket (2DPC, 8 channel DDR5) |
Memory – Speed | 3200Mhz @2DPC | 4400Mhz @2DPC 4800Mhz @1DPC |
Memory – type & size | – RDIMM & LRDIMM support (up to 256GB/DIMM, 16Gb die) | – RDIMM & LRDIMM (up to 256GB/DIMM, 16Gb die) |