QCT Introduces New Server Systems with
3rd Gen Intel® Xeon® Scalable Processors

3rd Gen QuantaGrid and QuantaPlex systems deliver innovations
for a broad selection of workloads

Benchmark for IceLake on QuantaGrid D53XQ-2U (2S2U plaorm)

3rd Gen Intel Xeon Scalable Processors optimized with up to 1.5X general compute performance gain vs. Cascade Lake and build in Acceleraon for most demanding workloads that our customer need. AI with DL boost, Speed Select, and Intel® Optane™ persistent memory Barlow Pass aims to reduce latencies and optimize workloads that are memory, capacity, and TCO enhanced.

QCT 2 Socket Ice Lake vs Cascade Lake Performance
SPECCPU INT Rate
Up to 90%
SPECCPU FP Rate
Up to 77%
SPECJBB Max jops

Up to 51%

SPECJBB Crical jops

Up to 52%

Gen to Gen CPU comparison

Features

2nd Gen Intel® Xeon® Scalable Processor


3rd Gen Intel® Xeon® Scalable Processor
Cores Per Socket
 Up to 28 Cores


 Up to 40 Cores

TDP (W)
 70W – 205W


 105W – 270W

UPI Speed (GT/s)
 Up to 3x UPI @ 10.4 GT/s


 Up to 3x UPI @ 11.2 GT/s

PCIe Lanes/ Speed (GT/s)
 48 / PCIe 3.0 (8 GT/s)


 64 / PCIe 4.0 (16 GT/s)

MemoryQty
 12 DIMMs per socket
 (2DPC, 6 channel DDR4)


 16 DIMMs per socket
 (2DPC, 8 channel DDR4 )

Speed
 2666Mhz @2DPC
 2933Mhz @1DPC


 3200Mhz @2DPC

Type & Size
 - RDIMM & LRDIMM support (up to 128GB/DIMM, 16Gb die)
 - Intel® Optane™ PMem 100 series (AEP) 128GB, 256GB, 512GB


 - RDIMM & LRDIMM (up to 256GB/DIMM, 16Gb die)
 - Intel® Optane™ PMem 200 series (BPS) 128, 256, 512GB

3rd Gen Product Features

Intel Features
QCT systems powered by 3rd Gen Intel® Xeon® Scalable Processors Platform
Supports up to 40 CPU cores, PCIe Gen4, 8 channel DDR4 memory and Intel® OptaneTM persistent memory 200 series
GEN to GEN performance increase of up to 50%
Supports up to 200GbE data transmission with PCIe Gen4 x16 networking bandwidth
Enhanced data protection with Intel® Software Guard Extensions (SGX), Intel® Crypto Acceleration, and Intel® Platform Firmware Resilience (PFR)
QCT Features
Advanced cooling with up to 270W TDP CPU
Optimized for AI acceleration: Supports up to 3x single-width GPUs in 1U systems and up to 2x dual-width accelerators in 2U systems

OCP 3.0 SFF Mezz card optimized for Pull-Tab, Ejector and Internal lock types

Chassis intrusion mechanism implemented to alter and log abnormal chassis open events
Enhanced serviceability with tool-less, hot-swap designs (HDD, SSD, fan, PSU, PCIe riser bracket)
QCT system management tool: Orqestra

Product List

  • High density server optimized for extreme compute performance and space efficiency
  • Supports top-bin 3rd Gen Intel® Xeon® Scalable Processors in compact chassis
  • Featuring All NVMe with high memory footprint and additional expansionability
Coming soon

EGX63IS-1U

  • 3rd Gen Intel® Xeon® Scalable Processors
  • Single-socket processor, up to 512GB Memory
  • Centralized/Distributed Radio Access Network (RAN)
  • Multi-access edge computing (MEC), short depth, low power consumption, high expandability
  • NEBS Level 3
  • ORAN/OTII Compliance

EGX66Y-2U

  • 3rd Gen Intel® Xeon® Scalable Processors
  • Dual-socket processors, up to 2TB Memory
  • Centralized/Distributed Radio Access Network (RAN)
  • Multi-access edge computing (MEC), dual-width PCIe Gen4 GPU for edge AI inference
  • Short depth, low power consumption, high expandability
  • NEBS Level 3
  • ORAN/OTII Compliance